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MULTILAYER
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Base material: FR4 TG130, SEMI FLEX.
Dimensions: Max. 60 cm x 35 cm, Min. 1 cm x 1 cm
Quantity: Min. 1 unit, Max. 100 thousand units.
PCB thickness: 1.0 mm, 1.2 mm, 1.6 mm, 0.8 mm, 0.5 mm, 2.00 mm, 2.5 mm.
PCB color: Green, red, black, blue, white
Surface finish: HASL (SN / Pb), ENIG (silver), Gold
Copper Thickness: 1 oz., 2 oz., 6 oz.

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CHARACTERISTICS:
Our double layer circuits have excellent mechanical strength and excellent heat resistance.
Metallization is highly recommended for this material because the fiberglass core is easily attacked by the electrolyte copper process.
Dielectric Constant (1MHz): 4.58. Vitreous Transition (Tg): 135. Moisture Absorption of 0.10%. Conditions D 24/23

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